This site uses cookies and other tracking technologies to assist with navigation and your ability to provide feedback, analyse your use of our site and services and assist with our promotional and marketing efforts. You can read more about this in our Privacy Policy.
Akasa T5 Essential heat sink compound Thermal paste 4 W/m·K 5 g
In Stock
65 available
- Hi-performance thermal paste
- 4.0 W/mK
- Non-curing compound
- Grey
SKU #: AK-T505-5G
EAN #: 4710679550824
UNSPSC #: 32131008
- Low thermal resistance for hi-heat transfer
- Non-curing and non-electrically conductive properties
- Conveniently included wipes and spreader
Category: Heat Sink Compounds
| SKU | AK-T505-5G |
|---|---|
| EAN | 4710679550824 |
| Manufacturer | Akasa |
| Availability | Y |
Low Thermal Resistance for Hi-Heat Transfer
Heat can easily be transferred from CPU or GPU to heatsink due to its low thermal resistance for efficient performance. Getting the most out of your CPU and air/liquid heatsink cooler.
Easy and Safe Application
Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.
Conveniently Included Wipes and Spreader
Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.
Heat can easily be transferred from CPU or GPU to heatsink due to its low thermal resistance for efficient performance. Getting the most out of your CPU and air/liquid heatsink cooler.
Easy and Safe Application
Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.
Conveniently Included Wipes and Spreader
Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.
| Features | |
|---|---|
| Type | Thermal paste |
| Thermal resistance | 0.07 °C/W |
| Viscosity note | 4800000 |
| Thermal conductivity | 4 W/m·K |
| Operating temperature (T-T) | -50 - 220 °C |
| Product colour | Grey |
| Specific gravity | 2.6 g/cm³ |
| Weight & dimensions | |
| Weight | 5 g |
| Packaging data | |
| Quantity per pack | 1 pc(s) |
| Technical details | |
|---|---|
| Thermal resistance | 0.07 °C/W |
| Viscosity note | 4800000 |
| Thermal conductivity | 4 W/m·K |
| Operating temperature (T-T) | -50 - 220 °C |
| Operational conditions | |
| Operating temperature (T-T) | -50 - 220 °C |
| Colour | |
| Product colour | Grey |
| Logistics data | |
| Quantity per pack | 1 pc(s) |